Thermal Management
Peak Performance Meets Mass Production
High Density Cooling
Fabric8Labs partners with leading semiconductor and photonics innovators to deliver liquid cooling hardware engineered for the extreme heat loads of AI, ML, optical interconnects, and custom silicon.
Our electrochemically manufactured solutions feature micron-scale precision and application-specific geometries that can double thermal performance versus traditional CPU/GPU cold plates — unlocking higher TDPs, improved reliability, and design freedom from the chip to the system level.
From advanced GPUs to high-density optical modules, Fabric8Labs ECAM technology is setting new benchmarks — including a recently demonstrated 3.5 kW cold plate with Wiwynn for next-generation AI infrastructure.
Key Advantages:
-
Proven Scalability: 3.5 kW cold plate design with Wiwynn validates high-power, production-ready performance for AI and optical workloads.
-
Application-Specific Cooling: Ultra-fine resolution channels matched to each device’s power map for consistent die temperatures and minimal pressure drop.
-
Direct-to-Substrate Printing: Pure copper structures built directly onto metal foil, ceramic, or packaged silicon to eliminate TIMs and boost thermal conductivity.
Single-Phase Liquid Cooling
Efficient, scalable, and ready for today's densest workloads. Our electrochemically manufactured cold plates bring unmatched design flexibility and thermal performance to direct-to-chip cooling. From early prototyping to rack-scale deployment, we enable single-phase cooling that’s built to last.
Custom Silicon Cooling
One size doesn’t fit your silicon. We build cold plates around your chip’s exact thermal profile — no bonding, no tooling delay, and no design compromises. Whether you’re chasing peak performance or a tight power budget, ECAM delivers cooling that’s truly made to fit.
Two-Phase Liquid Cooling
When watts per mm² push past single-phase limits, two-phase designs step in. We fabricate fine-resolution, copper boiling structures that manage vapor flow, reduce hotspot temps, and unlock thermal headroom — all with mass manufacturing in mind.
Immersion Cooling
Boiling starts with surface science. Our room-temperature ECAM process grows ultra-fine copper structures that control nucleation and support efficient boiling. Whether for immersion, vapor chamber, or hybrid setups, we help shape the future of AI-ready thermal design.
From Prototype to Production
The ECAM platform supports the complete photonics development cycle, from early design validation to high-volume manufacturing:
-
Rapid digital prototyping – Move from concept to functional hardware in days, enabling fast iteration and design refinement without tooling delays. This agility allows engineers to test multiple geometries in parallel and quickly converge on the optimal thermal solution.
-
Volume manufacturing – Produce high-precision inserts at scale with consistent geometry, material quality, and thermal performance. ECAM’s parallelized, room-temperature process ensures that scaling output does not compromise part accuracy or reliability, making it ideal for both niche and mass-market photonics applications.
-
Supply chain integration – Deliver fully finished, ship-to-line inserts ready for assembly by your preferred cold plate or optical module provider, ensuring seamless adoption into existing manufacturing workflows. Fabric8Labs can align production schedules, packaging, and quality assurance protocols with your current suppliers to accelerate deployment.
Proven Design Strategies
Fabric8Labs’ ECAM technology delivers cooling solutions engineered for the most demanding semiconductor and photonics applications—whether it’s GPUs in AI data centers, or high-power laser diodes and optical transceivers in advanced communication systems. Every design is optimized for both peak thermal performance and scalable manufacturability.
- Power-Map Optimization – ECAM enables microchannel geometries precisely matched to each device’s heat flux profile, targeting cooling capacity exactly where GPUs, AI accelerators, or photonic components generate the most heat.
- Hybrid Baseplate Integration – Merge conventionally machined surfaces for mechanical or optical alignment with ECAM-printed microstructures for heat removal, creating a single assembly that meets both precision alignment and extreme cooling requirements.
- Reliability at Scale – Monolithic, high-purity copper features reduce leak paths, resist fouling, and deliver stable performance over extended operating lifetimes—critical for hyperscale deployments and mission-critical optical networks.
ECAM Enables Best-In-Class Liquid Cooling
Unlock Mass-Customized, High-Performance Cooling with ECAM. Rapidly deploy optimized thermal solutions tailored for your most demanding high TDP applications. Get the technical data and performance curves – download our B200 case study.